Brief Summary
This podcast episode features Jan Vardaman, President of TechSearch International, discussing the drivers, market segments, and technology platforms in advanced semiconductor packaging and heterogeneous integration. The conversation covers the increasing importance of chiplets, various packaging solutions, and the role of different substrate materials. Key takeaways include the significance of cost, the diversity of approaches based on company capabilities, and the absence of a one-size-fits-all packaging solution.
- Cost is a major driver for chiplet adoption due to savings on silicon fab costs.
- Different market segments have varying needs, leading to diverse packaging solutions.
- There is no single packaging solution; the choice depends on design, supply chain, and performance goals.
Introduction to 3D IC Chiplet Ecosystems
The host, John McMillan, introduces the Siemens EDA podcast series on 3D IC chiplet ecosystems. The series explores semiconductor chiplet integration and advanced technology platforms using 2.5D and 3D techniques. The podcast aims to uncover how the semiconductor industry is working to make 3D IC mainstream by talking to industry leaders and subject matter experts to discuss the latest 3D IC industry trends and roadmaps.
Jan Vardaman's Background and Focus
Jan Vardaman, President of TechSearch International, provides background on her company, which has been covering developments in packaging for 37 years. Their focus is entirely on advanced packaging and related developments, noting that the pace of innovation is faster than ever. TechSearch International is excited to discuss these topics.
Drivers for Advanced Integration
Cost is identified as a major driver for advanced integration, particularly the interest in chiplets as a new way to design ICs. Fabricating everything as a monolithic die on the most expensive nodes is becoming unaffordable. While monolithic dies are still viable when possible, many IC designs have components that don't scale as well as logic. Fabricating these components in legacy nodes can save money on silicon fab costs. The goal is to disaggregate the IC design and reassemble it in the package to achieve high performance and energy efficiency.
Market Segments and Industries Driving Activities
While hyperscale AI and HPC are significant, there are other applications driving advanced integration. Nvidia's processors, up until Blackwell, have used monolithic die designs in packages with HBM, which is considered heterogeneous integration. AMD has implemented chiplet designs for servers, desktops, and gaming, arguing that silicon savings outweigh additional packaging costs. The industry is working towards including third-party chiplet designs, which presents challenges in testing and communication protocols. Nvidia's new GPU for AI uses a chiplet architecture in a TSMC CoWoS-L package, while AMD's MI300 series uses a 3D stacking with hybrid bonding, achieving good energy efficiency and performance.
Different Integration Solutions and Platforms
Different industries and markets have varying needs, leading to diverse integration solutions and platforms. The choice of package depends on the company's supply chain and capabilities. For example, the MI300 series uses a silicon interposer (CoWoS) by TSMC, while the new Blackwell uses CoWoS-L with an RDL interposer. Amazon uses CoWoS-R, an RDL solution without bridges, and Intel favors embedded bridges in laminate substrates. A chiplet is the architecture and IC design, while the package is chosen based on design philosophy and supply chain.
Substrate Materials and Their Applications
The choice of substrate material depends on the desired outcome and the supply chain. Silicon and RDL interposers typically connect to a buildup substrate with a C4 bump. RDL structures can have embedded silicon bridges or not. AMD and Nvidia favor these solutions for high-performance cases. Intel prefers EMIB solutions with bridges embedded in laminate substrates, providing high density where the bridge is located. The cost-effectiveness of each solution depends on the design and supplier chain. RDL interposers are gaining popularity due to their potential for finer pitch scaling. Ultimately, there is no single packaging solution, as it depends on internal capabilities and system-level performance goals.
Siemens Innovator 3D IC Platform and Conclusion
The Siemens Innovator 3D IC platform was named the winner of the 3D InCites 2025 Award for Technology Enablement. It is an AI-enhanced co-design tool that ensures digital continuity through system-centric planning for die interposer package and PCV design. The platform provides early insights into thermal, mechanical, and electrical performance, reducing design iterations and accelerating development. The host thanks Jan for sharing her knowledge and encourages listeners to check the show notes for more information and to subscribe for future episodes.
